Hardware Engineering

Experts in high speed hardware development spanning digital, analog and mixed signal products. Deployed products for commercial, industrial and aerospace applications. Products designed for regulatory certifications and manufacturability. Single window for hardware design, development and manufacturing.

  • Digital designs upto 1066Mbps
  • High speed and high precision Mixed Signal Designs
  • Designs for commercial, industrial, medical and defense certification
  • Design for manufacture, testing and assembly
  • High density multilayer PCB upto 16 layers with blind and buried vias
  • Reliability (MTBF, FMEA etc)
  • Small footprint designs
  • Design for form factor
  • Industrial Design
  • Specialized Audio and Video designs
  • Low power design
  • Wireless (WiFi, BLE, 6LoWPAN, GSM/GPRS etc)

Related Topics

  • Digital Design, PCIe, High Speed

    Digital Designs

    Digital Designs

    • DDR2, LPDDR2, DDR3 up to 1066 Mbps
    • PCIe upto 5Gbps/lane, GigE – 1Gbps
    • USB 3.0, SPI, SDIO, I2S
  • Analog, RF, FPGA, SoC

    Mixed Signal & RF

    Mixed Signal & RF

    • High precision serial ADCs up to 24 bits accuracy
    • High speed ADCs – parallel (40Msps) serial (LVDS up to 3Gbps)
    • FPGA / SoC based data acquisition and streaming
    • WiFi, Bluetooth, Zigbee, GPS
    • 3G, 4G, LTE
    • LoRA
  • Ruggedization, Product Certification

    Reliability & Certification

    Reliability & Certification

    • MTBF, FMEA, Component De-rating
    • On-going and Production Reliability
    • FCC, CE, UL
    • MIL-STD-810D and MIL-STD-461F
    • PCB – Class2 & Class3 Specifications
  • Signal Integrity, Thermal and Power Simulation, High Density Interconnect

    PCB Layout & Analysis

    PCB Layout & Analysis

    • Pre-Post SI simulation
    • PI and Thermal simulation
    • High Density Interconnect (HDI)
    • Flex and RigidFlex
  • Yield, Automated Testing

    DFM and Testing

    DFM and Testing

    • PCB Yield improvements
    • Support for automated/semi-automated testability
    • Test coverage improvements
    • Cost Reduction
  • Small form factor

    Small Footprint Designs

    Small Footprint Designs

    • High Density Interconnect (HDI)
    • Blind and buried micro vias
    • PoP Technology
    • Rigid-flex PCBs
    • Miniature components
    • Complex assemblies
  • Mechanical integration, IP protection, 3D Prototype

    Industrial Design

    Industrial Design

    • DXF and STEP file integration
    • Plastics and Metal based enclosures
    • IP65/66/67 designs
    • 3D Prototyping
    • Design for manufacturability
  • Power management, Battery management

    Battery / Power Management

    Battery / Power Management

    • Power-performance tradeoffs
    • Low power designs

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